14 May 2004 Influence of resin properties to resist performance at ArF lithography
Author Affiliations +
Abstract
The ArF resist has been evaluated focusing on resin character such as molecular weight, monomer composition and polydispersity (Pd). The resin properties were investigated to elucidate that which parameter was affected to the line edge roughness (LER). The Pd was correlated with LER. As the Pd was large, the LER was small. The resin molecular weight and monomer composition were affected to their vertical profile. Low molecular weight portion rich resin resulted in round and t-top profile, whilst high molecular weight rich resin resulted in square profile. The amount of lower molecular weight fraction was changed by purification method. The lower molecular weight resin caused severe tapered profile. It was concluded that 1) shift of Mw to smaller and 2) higher content of low molecular size fraction lead to rounded and tapered pattern profile. Lot-to-lot stable good pattern profile has achieved by controlling polymer molecular weight and content of low molecular size fraction in small variation range.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sangwoong Yoon, Sangwoong Yoon, Myungsun Kim, Myungsun Kim, Hong Lee, Hong Lee, Do Young Kim, Do Young Kim, Young Hoon Kim, Young Hoon Kim, Boo Deuk Kim, Boo Deuk Kim, Jae Hyun Kim, Jae Hyun Kim, Kyung-Mee Kim, Kyung-Mee Kim, Shi Yong Lee, Shi Yong Lee, Young Ho Kim, Young Ho Kim, Sang-Mun Chon, Sang-Mun Chon, } "Influence of resin properties to resist performance at ArF lithography", Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); doi: 10.1117/12.533950; https://doi.org/10.1117/12.533950
PROCEEDINGS
8 PAGES


SHARE
Back to Top