Paper
14 May 2004 Surface conditioning solutions for pattern collapse reduction
Peng Zhang, Manuel Jaramillo Jr., Danielle M. King, Madhukar B. Rao, Bridget L. O'Brien, Brenda F. Ross
Author Affiliations +
Abstract
Recently, there has been a growing interest in using surface conditioning solutions to solve the pattern collapse challenge. In this study, we investigated both pattern collapse and defect performance of surface conditioning solutions on multiple 193 nm resist systems. While the surface conditioning solutions were able to reduce the pattern collapse with good defect control with a majority of resist systems, it can increase the defect level on certain resist. Shortening the surface treatment step and optimizing the formulation can reduce the defect counts to the control level without compromising pattern collapse performance. This study also demonstrated that the surface conditioning solution is compatible with 248 nm processing, enabling the patterning of 90 nm 1:1.2 pitch lines.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Peng Zhang, Manuel Jaramillo Jr., Danielle M. King, Madhukar B. Rao, Bridget L. O'Brien, and Brenda F. Ross "Surface conditioning solutions for pattern collapse reduction", Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); https://doi.org/10.1117/12.535283
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CITATIONS
Cited by 4 scholarly publications.
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KEYWORDS
Process control

Photoresist processing

Optical lithography

Semiconducting wafers

Control systems

Scanners

Capillaries

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