28 May 2004 Aberration measurement and matching: a correlation of measurement techniques and dedication scheme implications
Author Affiliations +
Proceedings Volume 5377, Optical Microlithography XVII; (2004); doi: 10.1117/12.535288
Event: Microlithography 2004, 2004, Santa Clara, California, United States
The need to improve the Overlay and CD Budget requirements of current device technologies has driven the introduction of tool dedication schemes in semiconductor manufacturing. Dedication schemes have provided an opportunity to minimize systematic field distortion differences from layer to layer. The cost and manufacturing complexity of dedication schemes can however be a burden on the process and tools required. We will present experimental results of an aberration measurement method used on a Front End of Line tool-set to empirically describe the matching of a series of tools used in a dedicated processing scheme. We will also show simulation results of Pattern Placement Error and CD uniformity effects for the highlighted aberrations. We will use these findings to support product results generated while exercising dedication break analyses experiments on this tool set.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
William R. Roberts, Igor Jekauc, "Aberration measurement and matching: a correlation of measurement techniques and dedication scheme implications", Proc. SPIE 5377, Optical Microlithography XVII, (28 May 2004); doi: 10.1117/12.535288; https://doi.org/10.1117/12.535288

Overlay metrology

Lens design



Front end of line


Critical dimension metrology


Introduction of new techniques for matching overlay enhancement
Proceedings of SPIE (September 14 2001)
150-nm generation lithography equipment
Proceedings of SPIE (July 26 1999)
Advanced mix and match using a high NA i line...
Proceedings of SPIE (July 05 2000)
Influence of coma effect on scanner overlay
Proceedings of SPIE (July 16 2002)
High-order wafer alignment in manufacturing
Proceedings of SPIE (April 04 2012)

Back to Top