28 May 2004 Initial assessment of the lithographic impact of the use of a hard pellicle on wafer distortion
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Abstract
Due to the short life span of soft pellicles at the 157nm wavelength, hard pellicles are currently considered the primary option for reticle protection. The hard pellicle is an 800μm thick fused silica plate, which while protecting the reticle surface from particles, will also act as an optical element in the exposure system and cause unwanted aberrations. This paper specifically explores the hard pellicle’s impact on image distortion. We present and validate a methodology to predict pellicle induced wafer distortion based upon the pellicle shape as measured using an interferometer. Overlay results using hard pellicle A to hard pellicle B exposures and mix and match pellicle to no pellicle exposures are also presented. The results obtained so far are positive and have not yielded any show stoppers for the use of hard pellicles in production.
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Michael K. Kocsis, Michael K. Kocsis, Peter De Bisschop, Peter De Bisschop, Richard Bruls, Richard Bruls, Andrew Grenville, Andrew Grenville, Chris Van Peski, Chris Van Peski, } "Initial assessment of the lithographic impact of the use of a hard pellicle on wafer distortion", Proc. SPIE 5377, Optical Microlithography XVII, (28 May 2004); doi: 10.1117/12.537521; https://doi.org/10.1117/12.537521
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