29 April 2004 Development of customer assistance software for alignment parameter optimization
Author Affiliations +
Wafer alignment plays a significant role in the advancement of microlithography and has been constantly improved to meet various situations. As a result, its configuration is very dynamic and it sometimes requires considerable cost for process optimization. Software has been developed which evaluates the alignment performance in a variety of conditions from the minimal data set. It allows the user to perform off-line optimization, essentially reducing the amount of interruption toward production. This article illustrates the simulation method implemented in the software, OverLay EValuation program (OLEV).
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yuho Kanaya, Yuho Kanaya, Shinichi Nakajima, Shinichi Nakajima, "Development of customer assistance software for alignment parameter optimization", Proc. SPIE 5378, Data Analysis and Modeling for Process Control, (29 April 2004); doi: 10.1117/12.536104; https://doi.org/10.1117/12.536104

Back to Top