Integrated electrical and SEM-based defect characterization for rapid yield ramp

Jacob Orbon; Lior Levin; Ofer Bokobza; Rinat Shimshi; Manjari Dutta; Brian Zhang; Dennis Ciplickas; Teri Pham; Jim Jensen

doi:10.1117/12.536469

29 April 2004 Integrated electrical and SEM-based defect characterization for rapid yield ramp

Jacob Orbon, Lior Levin, Ofer Bokobza, Rinat Shimshi, Manjari Dutta, Brian Zhang, Dennis Ciplickas, Teri Pham, Jim Jensen

Author Affiliations +

Proceedings Volume 5378, Data Analysis and Modeling for Process Control; (2004) https://doi.org/10.1117/12.536469
Event: Microlithography 2004, 2004, Santa Clara, California, United States

Abstract

Challenges of the new nanometer processes have complicated the yield enhancement process. The systematic yield loss component is increasing, due to the complexity and density of the new processes and the designs that are developed for them. High product yields can now only be achieved when process failure rates are on the order of a few parts per billion structures. Traditional yield ramping techniques cannot ramp yields to these levels and new methods are required. This paper presents a new systematic approach to yield loss pareto generation. The approach uses a sophisticated Design-of-Experiments (DOE) approach to characterize systematic and random yield loss mechanisms in the Back End Of the Line (BEOL). Sophisticated Characterization Vehicle (CV)^TM test chips, fast electrical test and Automatic Defect Localization (ADL) are critical components of the method. Advanced statistical analysis and visualization of the detected and localized electrical defects provides a comprehensive view of the yield loss mechanisms. In situations where the defects are not visible in a SEM of the structure surface, automated FIB and imaging is used to characterize the defect. The combined approach provides the required resolution to appropriately characterize parts per billion failure rates.

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Jacob Orbon, Lior Levin, Ofer Bokobza, Rinat Shimshi, Manjari Dutta, Brian Zhang, Dennis Ciplickas, Teri Pham, and Jim Jensen "Integrated electrical and SEM-based defect characterization for rapid yield ramp", Proc. SPIE 5378, Data Analysis and Modeling for Process Control, (29 April 2004); https://doi.org/10.1117/12.536469

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