29 April 2004 Propagation of APC models across product boundaries
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Abstract
The BCT solution is an automatic correction for systematic offset built into the PCS product based on calibration from 2-5 wafers. This paper explores the validity of a predictive model for process control for use by manufacturers of semiconductor devices with a multitude of products or part numbers. The proposed model defines the parameters of interests as a function of the film stack, tool attributes, and mask characteristics. The paper proposes a process for model development that dramatically reduces the cost of materials, tool time, and engineering effort.
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Tito Chowdhury, Mark Freeland, Ole Krogh, Geethakrishnan Narasimhan, Gayathri Raghavendra, "Propagation of APC models across product boundaries", Proc. SPIE 5378, Data Analysis and Modeling for Process Control, (29 April 2004); doi: 10.1117/12.536454; https://doi.org/10.1117/12.536454
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