The X Architecture is a new way of orienting the interconnect on an integrated circuit using diagonal pathways, as well as the traditional right-angle, or Manhattan, configuration. By enabling designs with significantly less wire and fewer vias, the X Architecture can provide substantial improvements in chip performance, power consumption and cost. Members of the X Initiative semiconductor supply chain consortium have demonstrated the production worthiness of the X Architecture at the 130-nm and 90-nm process technology nodes. This paper presents an assessment of the manufacturing readiness of the X Architecture for the 65-nm technology node. The extent to which current production capabilities in mask writing, lithography, wafer processing, inspection and metrology can be used is discussed using the results from a 65-nm test chip. The project was a collaborative effort amongst a number of companies in the IC fabrication supply chain. Applied Materials fabricated the 65-nm X Architecture test chip at its Maydan Technology Center and leveraged the technology of other X Initiative members. Cadence Design Systems provided the test structure design and chip validation tools, Dai Nippon Printing produced the masks and Canon’s imaging system was employed for the photolithography.