Double Telecentric Wafer Stepper Using Laser Scanning Method

Akiyoshi Suzuki

doi:10.1117/12.947740

23 July 1985 Double Telecentric Wafer Stepper Using Laser Scanning Method

Akiyoshi Suzuki

Proceedings Volume 0538, Optical Microlithography IV; (1985) https://doi.org/10.1117/12.947740
Event: 1985 Microlithography Conferences, 1985, Santa Clara, United States

Abstract

A stepper of new concept has been developed. It uses double telecentric lens and TTL laser scanning method. It is TTL on axis stepper in the ture sense, because alignment is checked directly before exposure. The projection optics can resolve 1.0 μm in production and has small distortion. The alignment accuracy within 0.25 μm ( 3 o) is achieved.

Citation Download Citation

Akiyoshi Suzuki "Double Telecentric Wafer Stepper Using Laser Scanning Method", Proc. SPIE 0538, Optical Microlithography IV, (23 July 1985); https://doi.org/10.1117/12.947740

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