Paper
21 July 2004 Stress-strain behavior of Cu-Al-Ni single-crystal shape memory alloy at high temperature: shape memory effects
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Abstract
The experimental results of a preliminary study on stress-strain behavior of Cu-13.3% Al- 4% Ni (by wt.) single crystal shape memory alloy grown along the [001] direction at high temperatures are given. An Instron testing machine with a high temperature environmental chamber has been used to study the quasi-static stress-strain response of 1.5 mm diameter Cu-Al-Ni single crystal wires at different ambient temperatures in the range 100 - 160°C. Local strain measurements using a highly sensitive extensometer are compared with overall strain measurements computed from the net displacements between grips. The effect of stress cycles on overall strain on full loading, after unloading and after heating in between stress cycles has been discussed.
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Ganesh Kumara Kannarpady, Steve Trigwell, Abhijit Bhattacharyya, Ivan Viahhi, and Sergei Pulnev "Stress-strain behavior of Cu-Al-Ni single-crystal shape memory alloy at high temperature: shape memory effects", Proc. SPIE 5387, Smart Structures and Materials 2004: Active Materials: Behavior and Mechanics, (21 July 2004); https://doi.org/10.1117/12.539558
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KEYWORDS
Crystals

Shape memory alloys

Temperature metrology

Crystallography

Actuators

Interfaces

Nickel

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