Paper
29 July 2004 Analytical approach for characterization of sputtered thin film microthermocouples (STFMT)
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Abstract
This paper describes an analytical approach for the characterization of sputtered thin film microthermocouples (STFMT) to determine the thermophysical properties of microstructures. A complete spatially one-dimensional (1D) boundary value problem with a thin film sputtered sample sandwiched between an heater/RTD (Resistance Temperature Detector) at its one end and the thin film microthermocouple at its other end has been solved to show the effects of various thermoelements on Seebeck voltage, heat loss/gain effects between the device & the environment, as well as at the contact area between the sample and microthermocouple tip. An interesting outcome for three different pairs of thermoelements studied (one material is always Titanium, and the other is Chromium, Chromium-Silicide and Tantalum, in turn) is that higher the Seebeck voltage of the microthermocouples under consideration, less accurate is the temperature sensed by it.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Muhammad Imran and Abhijit Bhattacharyya "Analytical approach for characterization of sputtered thin film microthermocouples (STFMT)", Proc. SPIE 5389, Smart Structures and Materials 2004: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, (29 July 2004); https://doi.org/10.1117/12.539820
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CITATIONS
Cited by 4 scholarly publications.
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KEYWORDS
Thin films

Convection

Interfaces

Microelectromechanical systems

Chromium

Tantalum

Temperature metrology

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