21 July 2004 Continuum simulation of adhesive-adherend interface layers for USNDE
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Abstract
Characterization of effective interfacial properties in adhesive joints is one of the major challenges in NDE. The interlayer between the adhesive and the adherend is typically of the order of 1μm and even over this distance -- it is realized -- the interlayer could be a function of depth depending on adhesive penetration and pore formation on adherend surface affecting the ultimate bond strength. The thinness of this complex region is taken advantage of in the present work to treat it as a continuum with different length scales at micro and macro levels. The dispersion-attenuation of leaky guided waves is simulated to facilitate USNDE of this region.
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R. Yerikalapudy Vasudeva, R. Yerikalapudy Vasudeva, Gopinathan Sudheer, Gopinathan Sudheer, } "Continuum simulation of adhesive-adherend interface layers for USNDE", Proc. SPIE 5392, Testing, Reliability, and Application of Micro- and Nano-Material Systems II, (21 July 2004); doi: 10.1117/12.543241; https://doi.org/10.1117/12.543241
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