Paper
28 May 2004 Process optimization using lithography simulation
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Proceedings Volume 5401, Micro- and Nanoelectronics 2003; (2004) https://doi.org/10.1117/12.556987
Event: Micro- and Nanoelectronics 2003, 2003, Zvenigorod, Russian Federation
Abstract
Lithography simulation has become an indispensable tool for understanding and optimization of lithographic processes and for the development of new processes. Aerial image simulations are used to evaluate the imaging of designed photomasks by projection steppers or scanners and to explore the impact of optical parameters such as numerical aperture, spatial coherence, defocus, and wave aberrations on the imaging performance. Other simulation approaches are used to describe the impact of the photoresist thickness, of the post exposure (PEB) temperature, and of the development characteristics of the photoresist on the total process performance. This article reviews the most important modeling approaches which are used in lithography simulation. Several examples demonstrate the application of modern simulation tools for the optimization of lithographic mask and illumination geometries. This includes the application of genetic algorithms for global parameter optimization and the rigorous electromagnetic modeling of light diffraction from advanced lithographic masks.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andreas Erdmann "Process optimization using lithography simulation", Proc. SPIE 5401, Micro- and Nanoelectronics 2003, (28 May 2004); https://doi.org/10.1117/12.556987
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KEYWORDS
Photomasks

Lithography

Projection systems

Photoresist materials

Diffraction

Image processing

Optimization (mathematics)

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