A low-cost thermal imaging sensor for networked applications

Paul A. Manning; Nick J. Parkinson

doi:10.1117/12.543497

1 September 2004 A low-cost thermal imaging sensor for networked applications

Paul A. Manning, Nick J. Parkinson

Proceedings Volume 5417, Unattended/Unmanned Ground, Ocean, and Air Sensor Technologies and Applications VI; (2004) https://doi.org/10.1117/12.543497
Event: Defense and Security, 2004, Orlando, Florida, United States

Abstract

The cost of thermal imaging technology has, up until now, precluded its use in networked sensor systems which require sensors to be deployed in very large numbers. Detectors based on the manufacturing processes used in the production of conventional silicon chips offer a breakthrough in cost compared to other technologies. Despite having modest performance, this technology offers a route toward a very cost-effective thermal imaging sensor for networked applications, where the limited performance of each individual sensor is less significant due to the advantage given by large numbers of sensors covering the target area. By carefully optimising the detector format, this low-cost technology is able to achieve useful performance at short ranges which are suited to a networked sensor system.

Citation Download Citation

Paul A. Manning and Nick J. Parkinson "A low-cost thermal imaging sensor for networked applications", Proc. SPIE 5417, Unattended/Unmanned Ground, Ocean, and Air Sensor Technologies and Applications VI, (1 September 2004); https://doi.org/10.1117/12.543497

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