7 April 2004 Packaging and characterization of micro-opto-electro-mechanical systems
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Proceedings Volume 5445, Microwave and Optical Technology 2003; (2004) https://doi.org/10.1117/12.558489
Event: Microwave and Optical Technology 2003, 2003, Ostrava, Czech Republic
Modern optical analytics require more and more compact and cost-effective modules for analysis of surfaces, solids, thin films, powders, pastes, gels, liquids and alike. Thereby a fast and non-invasive measurement is often necessary. Microsystem technology, more precisely Micro-Opto-Electro-Mechanical System (MOEMS) technology is suitable for the realization of such modules. Different miniaturized optical analyzers employing MOEMS have been developed at the Fraunhofer Institute for Reliability and Microintegration (IZM) in collaboration with the Center for Microtechnologies (ZfM) and the company COLOUR CONTROL Farbmesstechnik GmbH. These devices are based on the principle of spectral sensing in the infrared range. Due to the requirement of compact dimensions and short optical paths a high packaging accuracy is necessary. In the development process different setups with a continuous packaging improvement have been realized. The first packaging principle was based on particularly assembled laser-cut stainless steel sheets and optical standard components. The design requires exact positioning of the functional elements to attain a sufficient optical resolution. The reduction of the active components by means of monolithic combinations was one improvement. Further progress could be achieved by a package made of aluminum cast, whose models were provided using modern methods of rapid prototyping. Consequently adjustment tolerances will be minimized and the vibration stability will be increased. During the development process, simulations and characterization of the system are essential to obtain necessary improvements. Thereby an evaluation of the packaging accuracy regarding its influence on the defocus was made. According to precision and reproducibility, the optical and electrical performance are being tested.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ray Saupe, Ray Saupe, Thomas Otto, Thomas Otto, Volker Stock, Volker Stock, Uwe Fritzsch, Uwe Fritzsch, Thomas Gessner, Thomas Gessner, } "Packaging and characterization of micro-opto-electro-mechanical systems", Proc. SPIE 5445, Microwave and Optical Technology 2003, (7 April 2004); doi: 10.1117/12.558489; https://doi.org/10.1117/12.558489

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