Translator Disclaimer
20 August 2004 0.13-/0.15-μm production reticle process window qualification procedure for 200-mm manufacturing fab
Author Affiliations +
Proceedings Volume 5446, Photomask and Next-Generation Lithography Mask Technology XI; (2004) https://doi.org/10.1117/12.557698
Event: Photomask and Next Generation Lithography Mask Technology XI, 2004, Yokohama, Japan
Abstract
The increasing complexity of Resolution Enhancements Techniques (RET) in optical lithography requires careful qualification of new reticle designs when they arrive at the wafer fab before commiting them to printing product. In order to qualify the reticle designs at the wafer level, process window qualification (PWQ) is performed by inspecting wafers printed with the reticles to be qualified. The output from the wafer inspection tool provides information on the regions of marginality within the reticle field or features within the die which can have a smaller than expected process window. tsmc Fab 6, an advanced high volume production foundry fab, uses an effective and efficient standardized PWQ procedure to qualify new incoming reticle designs described herein.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Zih-Wen Chang, Chen-Ming Wu, Mabel Mo, Chin-Chung Shieh, D.S. Cheng, Chun-Chien Chen, Richard Y. Yang, David W. Randall, and Wen-Cheng Yu "0.13-/0.15-μm production reticle process window qualification procedure for 200-mm manufacturing fab", Proc. SPIE 5446, Photomask and Next-Generation Lithography Mask Technology XI, (20 August 2004); https://doi.org/10.1117/12.557698
PROCEEDINGS
9 PAGES


SHARE
Advertisement
Advertisement
Back to Top