Paper
20 August 2004 CD uniformity improvement by loading effect correction (LEC) function for 90-nm reticle
Colbert Lu, Torey Huang, Shone Lee
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Abstract
The etching loading effect is always a big issue for mask maker to get excellent critical dimension (CD) uniformity. For etching process, with different loading area density the etching rate is different and then micro-loading issue exists. In accordance with the shrinking of patterns on ultra-large scale integration (ULSI), higher CD accuracy on photomask is required. For the 130nm technology node, the SPEC of CD uniformity range is about 17 ~ 22nm. At common poly layer, the distribution of pattern density is from 50% ~ 90%. The CD variation with different pattern density is 15 ~ 20nm. Besides adjusting the etching recipe to minimize the loading effect, we provide another solution. With loading effect correction (LEC) function on HL-950M, it offers a software method to calculate the pattern density and produce a dosage map to compensate the CD variation which is resulted from etching loading.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Colbert Lu, Torey Huang, and Shone Lee "CD uniformity improvement by loading effect correction (LEC) function for 90-nm reticle", Proc. SPIE 5446, Photomask and Next-Generation Lithography Mask Technology XI, (20 August 2004); https://doi.org/10.1117/12.562776
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KEYWORDS
Etching

Critical dimension metrology

Photomasks

Chromium

Data corrections

Reticles

Modulation

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