20 August 2004 Study of mask process development for EUVL
Author Affiliations +
Proceedings Volume 5446, Photomask and Next-Generation Lithography Mask Technology XI; (2004) https://doi.org/10.1117/12.557817
Event: Photomask and Next Generation Lithography Mask Technology XI, 2004, Yokohama, Japan
Abstract
EUVL mask process of absorber layer dry etching and defect repair were evaluated. TaGeN and Cr were selected for absorber layer and buffer layer, respectively. These absorber layer and buffer layer were coated on 6025 Qz substrate. Two dry etching processes were evaluated for absorber layer etching. One is CF4 gas process and the other is Cl2 gas process. CD uniformity, selectivity, cross section profile and resist damage were evaluated for each process. FIB-GAE and AFM machining were applied for absorber layer repair test. XeF2 gas was used for FIB-GAE. Good selectivity between absorber layer and buffer layer was obtained using XeF2 gas. However, XeF2 gas causes side etching of TaGeN layer. AFM machining repair technique was demonstrated for TaGeN layer repair.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tsukasa Abe, Masaharu Nishiguchi, Tsuyoshi Amano, Toshiaki Motonaga, Shiho Sasaki, Hiroshi Mohri, Naoya Hayashi, Yuusuke Tanaka, Hiromasa Yamanashi, Iwao Nishiyama, "Study of mask process development for EUVL", Proc. SPIE 5446, Photomask and Next-Generation Lithography Mask Technology XI, (20 August 2004); doi: 10.1117/12.557817; https://doi.org/10.1117/12.557817
PROCEEDINGS
9 PAGES


SHARE
RELATED CONTENT


Back to Top