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8 September 2004 Flip-chip assembly for photonic circuits
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When tackling the issue of low cost and enabled mass production for photonic circuits, the application of flip-chip technology creates huge expectations. We report on the results of a European project, in which it was the goal to demonstrate standard packaging technology in combination with specific integrated optics devices, entailing demands and limitations different from IC technology. In integrated optics devices, mainly the fiber attachment, but also some special features as the accessibility of windows at the top-side of the chip (e.g. sensing devices) are prohibiting the positioning of the optical layer stack and the solder pads for the flip-chip processing at the same side of the silicon wafer. Therefore, a feed through technology for the electrical wiring had to be included. Compatibility issues in combining the feed through technology with integrated optics processing have been solved. In this paper, we will demonstrate the successful feed-through metallization and flip-chip assembly in combination with an integrated optical sensor. The sensor, which has been designed for the measurement of relative humidity from 0-100 %RH, has been realized and packaged according to this technology. The feed-through metallization, solder type and chip carrier material have been chosen in a way that the demands of the demonstrator device are fulfilled according to a given specification.
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Kerstin Worhoff, Rene G. Heideman, Melis Jan Gilde, Kristian Blidegn, Matthias Heschel, and Hans van den Vlekkert "Flip-chip assembly for photonic circuits", Proc. SPIE 5454, Micro-Optics: Fabrication, Packaging, and Integration, (8 September 2004);

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