17 August 2004 Application on multichannel V-groove inspection
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Abstract
MOEMS packing architecture has been a major driving force for miniaturization of fiber optical components and optical communication devices. By using of bulk micromachining technology, V-grooves and micro-pits can be fabricated on a silicon wafer for coupling micro laser diode to fiber or fiber to fiber, and finally integrating into the small modules on chip packages. Because many factors, such as photolithography, material property, wet chemical etching process and operator's skills will influence the geometric accuracy, a precision measurement instrument is needed for in-situ inspection of V-grooves suitable for the critical passive optical alignments. This paper reported a novel 3D confocal profile measurement system for in-situ inspection of the depth of multi-channel V-grooves.
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Chongxiang Li, Anand Krishna Asundi, Zhong Ping Fang, "Application on multichannel V-groove inspection", Proc. SPIE 5458, Optical Micro- and Nanometrology in Manufacturing Technology, (17 August 2004); doi: 10.1117/12.544171; https://doi.org/10.1117/12.544171
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KEYWORDS
Inspection

Optical alignment

Silicon

3D metrology

Semiconducting wafers

Sensors

Anisotropic etching

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