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17 August 2004 Hybrid analysis of micromachined silicon thin film based on digital microscopic holography
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Abstract
Thin films are the elementary structures in many MEMS devices. Their applications can be found vastly in micromachined silicon pressure sensors. With respect to the specific demands in thin film analysis for microstructures, we present a hybrid approach integrating digital microscopic holographic measurement with finite element analysis in this paper for high-resolution full-field characterization of the micromachined silicon thin film. The pressure-induced membrane deflections are accurately measured with the developed system, and serve as reliable reference data to verify the FE model, which is then applied for strain and stress calculation and sensitivity characterization.
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Lei Xu, Xiaoyuan Peng, Jianmin Miao, and Anand Krishna Asundi "Hybrid analysis of micromachined silicon thin film based on digital microscopic holography", Proc. SPIE 5458, Optical Micro- and Nanometrology in Manufacturing Technology, (17 August 2004); https://doi.org/10.1117/12.546600
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