17 August 2004 Thickness measurement of thin transparent plates with a broadband wavelength-scanning interferometer
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Abstract
A novel broad-band telecom laser source is used to realize a lateral-shear scanning-wavelength interferometer for measuring the thickness of thin plates. We show that the wide tunability range allows to detect samples down to tens of microns with a relative uncertainty of less than 0.5% and a resolution of about 1 nm. A comparable accuracy in the thickness characterization of double-layer structures is also demonstrated. In turn, the wide tunability range needs the dispersion law of the materials to be taken into account in the model for correct thickness evaluation.
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Pasquale Maddaloni, Pasquale Maddaloni, Giuseppe Coppola, Giuseppe Coppola, Paolo de Natale, Paolo de Natale, Sergio de Nicola, Sergio de Nicola, Pietro Ferraro, Pietro Ferraro, Mariano Gioffre, Mariano Gioffre, Mario Iodice, Mario Iodice, } "Thickness measurement of thin transparent plates with a broadband wavelength-scanning interferometer", Proc. SPIE 5458, Optical Micro- and Nanometrology in Manufacturing Technology, (17 August 2004); doi: 10.1117/12.544955; https://doi.org/10.1117/12.544955
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