17 August 2004 Thickness measurement of thin transparent plates with a broadband wavelength-scanning interferometer
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Abstract
A novel broad-band telecom laser source is used to realize a lateral-shear scanning-wavelength interferometer for measuring the thickness of thin plates. We show that the wide tunability range allows to detect samples down to tens of microns with a relative uncertainty of less than 0.5% and a resolution of about 1 nm. A comparable accuracy in the thickness characterization of double-layer structures is also demonstrated. In turn, the wide tunability range needs the dispersion law of the materials to be taken into account in the model for correct thickness evaluation.
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Pasquale Maddaloni, Giuseppe Coppola, Paolo de Natale, Sergio de Nicola, Pietro Ferraro, Mariano Gioffre, Mario Iodice, "Thickness measurement of thin transparent plates with a broadband wavelength-scanning interferometer", Proc. SPIE 5458, Optical Micro- and Nanometrology in Manufacturing Technology, (17 August 2004); doi: 10.1117/12.544955; https://doi.org/10.1117/12.544955
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