Three-dimensional dynamic environmental MEMS characterization

Erik Novak

doi:10.1117/12.546646

17 August 2004 Three-dimensional dynamic environmental MEMS characterization

Erik Novak

Proceedings Volume 5458, Optical Micro- and Nanometrology in Manufacturing Technology; (2004) https://doi.org/10.1117/12.546646
Event: Photonics Europe, 2004, Strasbourg, France

Abstract

MEMS devices are gaining acceptance with many industries, but reliability concerns remain a barrier to entry into many markets. These inherently three-dimensional devices often have considerably more complex production processes and tolerances than standard silicon circuits. In addition, they require characterization not just in a static sense but also during actuation. Previous studies have shown that strobed interferometry is an effective method for complete three dimensional surface characterization of devices moving at frequencies up to 1MHz. To fully characterize MEMS devices, one must also examine the effect of environment on their critical performance parameters. Some devices, such as optical switches, may be subject to high amounts of power during use, and this can deform the devices temporarily or permanently through methods such as crystallization of polysilicon. Also, many devices, particularly for automotive telecommunications, and wireless applications are naturally subjected to a wide variety of environmental conditions. This paper presents measurement results of an optical switch as it is subjected to thermal stresses as an example of environmental characterization using strobed interferometry. A high-power laser is directed onto the device in a configuration equivalent to the desired use condition, and deformation amounts and damage threshold are quantified. Also, the challenges of interferometric dynamic device testing through a cover glass, needed for production characterization, are presented, along with solutions currently in place.

Citation Download Citation

Erik Novak "Three-dimensional dynamic environmental MEMS characterization", Proc. SPIE 5458, Optical Micro- and Nanometrology in Manufacturing Technology, (17 August 2004); https://doi.org/10.1117/12.546646

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available