Translator Disclaimer
25 May 2004 Influence of the emitter-base junction depth on the low frequency noise of Si/SiGeC heterojunction bipolar transistors
Author Affiliations +
Proceedings Volume 5470, Noise in Devices and Circuits II; (2004) https://doi.org/10.1117/12.546967
Event: Second International Symposium on Fluctuations and Noise, 2004, Maspalomas, Gran Canaria Island, Spain
Abstract
This work presents low frequency noise results in high-speed Si/SiGeC heterojunction bipolar transistors (HBTs). In this new generation of HBTs carbon doping is processed during of the deposit of the epitaxial SiGe base layer in order to suppress boron out-diffusion. Low frequency noise study is performed on three type of transistors that differ by the thickness of the Si cap layer. The Si Cap layer is a non intentional doped Si layer deposit after the SiGeC base layer and prior the contact emitter structure. Thus, the results on the three different Si Cap HBTs allow us to study the influence of the Emitter-Base junction depth on the low frequency noise of these HBTs. Measurements of the equivalent input noise spectral density (SiB) showed that spectra are composed of a 1/f component and the white noise is always reached at low bias. For the smallest transistors we observed the presence of Lorentzian(s) component(s). The excess noise sources are mainly located at the intrinsic emitter-base junction. Concerning the 1/f noise level, a quadratic dependence on base current bias and an inverse dependence on the emitter area are found. The normalized figure of merit, Kb = KfxAE, is ranging between 1.7 and 2.1 10-9 μm2 and is among the best results published concerning SiGe HBTs, this shows that the incorporation of carbon do not have any consequence for the 1/f noise level and more generally for the LF noise characteristics. In the Si Cap thickness range used in this work, no noise degradation is observed when the electrical emitter-base junction is getting closer to the poly/mono emitter interface. Hence DC and AC characteristics could be optimized without changing the LF noise performances. Finally, from measurements at the input and at the output, the emitter series resistance is extracted and is found to be proportional to the Si Cap thickness.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Cyril Chay, Patrice Benoit, Colette Delseny, Fabien Pascal, Pierre Llinares, Helene Baudry, and Jean-Charles Vildeuil "Influence of the emitter-base junction depth on the low frequency noise of Si/SiGeC heterojunction bipolar transistors", Proc. SPIE 5470, Noise in Devices and Circuits II, (25 May 2004); https://doi.org/10.1117/12.546967
PROCEEDINGS
9 PAGES


SHARE
Advertisement
Advertisement
Back to Top