8 October 2004 Realization of a large-area microbolometer sensor array for submillimeter astronomy applications: SCUBA-2
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Abstract
The realization of a large (40x32) pixel sub-array on a 3-inch silicon wafer brings unique challenges involving the integration of a variety of microfabrication techniques. Design, development and fabrication procedures are described, with conventional MEMS techniques in silicon being used where possible. High resolution imaging in the sub-millimetre range requires a pixel size of the order of one millimetre with a high signal/noise ratio detector, which must be addressed at cryogenic temperatures via a very low noise amplifying system. This has been realized using a combination of Transition Edge Sensors (TES) with amplification and multiplexing (MUX) by Superconducting Quantum Interference Devices (SQUID), which imposes particular requirements in the method of construction. This paper describes the details of the technologies used to overcome the conflicting demands of the different elements. The need to operate at millikelvin temperatures limits the materials that can be selected. Particular attention has been paid to the stresses induced in the structure by overlying films, bump bonding and any thermal processing.
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William Parkes, William Parkes, Alan M. Gundlach, Alan M. Gundlach, Camelia C. Dunare, Camelia C. Dunare, Jon G. Terry, Jon G. Terry, J. Tom M. Stevenson, J. Tom M. Stevenson, Anthony J. Walton, Anthony J. Walton, Eric Schulte, Eric Schulte, } "Realization of a large-area microbolometer sensor array for submillimeter astronomy applications: SCUBA-2", Proc. SPIE 5498, Millimeter and Submillimeter Detectors for Astronomy II, (8 October 2004); doi: 10.1117/12.550401; https://doi.org/10.1117/12.550401
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