Projection Printing

R. M. Finnila; S. C. Su; A. I . Braunstein

doi:10.1117/12.954252

1 March 1974 Projection Printing

R. M. Finnila, S. C. Su, A. I . Braunstein

Author Affiliations +

Proceedings Volume 0055, Technological Advances in Micro and Submicro Photofabrication Imagery; (1974) https://doi.org/10.1117/12.954252
Event: Acquisition and Analysis of Pictorial Data, 1974, San Diego, United States

Abstract

Many advantages in using projection mask alignment for the fabrication of integrated circuits include (1) the elimination of mask wear which allows a single plate to be used indefinitely and therefore justifies the added expense of obtaining defect-free masks, (2) greatly reduced defect densities in the photoresist patterns on the silicon wafers when compared with contact alignment methods, (3) better alignment accuracy in a projection aligner than with contact or proximity methods because the mask and wafer patterns are simultaneously in the focal plane of the alignment optics and there is no movement of the mask or wafer between alignment and exposure, and (4) higher resolution patterns on wafers by employing reducing optics.

Citation Download Citation

R. M. Finnila, S. C. Su, and A. I . Braunstein "Projection Printing", Proc. SPIE 0055, Technological Advances in Micro and Submicro Photofabrication Imagery, (1 March 1974); https://doi.org/10.1117/12.954252

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