15 July 2004 Glass microprocessing by laser-induced plasma-assisted ablation: fundamental to industrial applications
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Proceedings Volume 5506, Nonresonant Laser-Matter Interaction (NLMI-11); (2004) https://doi.org/10.1117/12.580222
Event: Nonresonant Laser-Matter Interaction (NLMI-11), 2003, St. Petersburg, Russian Federation
Abstract
Laser-induced plasma-assisted ablation (LIPAA), in which a single conventional pulsed laser of small size is employed (typically 2nd harmonic of Nd:YAG laser), enables to process transparent materials like glass with micron order spatial resolution, high speed and low cost. In this process, a laser beam is first directed to a glass substrate placed in vacuum or air. The laser beam passes through the substrate since the wavelength of laser beam must have no absorption by the substrate for the LIPAA process. The transmitted laser beam is absorbed by a solid target (typically metal) located behind the substrate. The target is then ablated, resulting in plasma generation. Due to the interaction of the laser beam and the laser-induced plasma, significant ablation takes place at the rear surface of substrate. This process demonstrates surface microstructuring, crack-free marking, color marking, painting and selective metallization of glass. Based on these achievements, we have developed a prototype of workstation of LIPAA microfabrication system which is now commercially available. The discussion includes mechanism and practical applications in industry of LIPAA process.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Koji Sugioka, Katsumi Midorikawa, Hiroshi Yamaoka, Yutaka Gomi, Masayoshi Otsuki, Ming Hui Hong, Dong Jiang Wu, Lai Lee Wong, Tow Chong Chong, "Glass microprocessing by laser-induced plasma-assisted ablation: fundamental to industrial applications", Proc. SPIE 5506, Nonresonant Laser-Matter Interaction (NLMI-11), (15 July 2004); doi: 10.1117/12.580222; https://doi.org/10.1117/12.580222
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