21 October 2004 Advanced FPA technology development at CMC Electronics
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Abstract
CMC Electronics Cincinnati (CMC) is now in production on 1Kx1K InSb focal plane arrays (FPAs), and continuing efforts on a third production run of 2Kx2K large format IR FPAs. These FPAs are based on our unique reticulated InSb architecture that has been shown to be inherently scalable across format size while maintaining performance properties. Performance in the 10mk to 15mk NETD range will be shown. The design and fabrication of these advanced FPAs has challenged the state of the art in fabrication processing, testing, and qualification of both InSb detectors and silicon ROICs. Program sponsored manufacturing improvement activities, as well as CMC internal R&D, continue to improve both the yields and the performance characteristics of these large arrays. The latest yield, operability, and performance data will be shown. Data will be drawn from a population of approximately 30 2Kx2K FPAs and 50 1Kx1K FPAs. A novel approach to rapid thermal cycling FPAs will we described and recent developments that enable the fabrication of reticulated, smaller pixel pitch devices and practical Ultra Large Format FPAs with additional capability and features will be discussed.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mike Davis, John W. Devitt, Mark E. Greiner, Rich Rawe, A. Timlin, David R. Wade, "Advanced FPA technology development at CMC Electronics", Proc. SPIE 5563, Infrared Systems and Photoelectronic Technology, (21 October 2004); doi: 10.1117/12.565665; https://doi.org/10.1117/12.565665
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