Paper
21 October 2004 Recent developments in infrared and visible imaging for astronomy, defense, and homeland security
Author Affiliations +
Abstract
Recent developments at Rockwell Scientific in the advancement of infrared and visible Focal Plane Array (FPA) technologies is presented. The technologies reviewed are hybrid silicon PIN visible, substrate-removed IR/VIS, MCT on silicon, 2-color, large format NIR FPAs, system-on-a-chip technology, and mosaic packaging. The basic aspects of each technology is described followed by a review of present performance achieved and the path for further development.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Thomas Y. Chuh "Recent developments in infrared and visible imaging for astronomy, defense, and homeland security", Proc. SPIE 5563, Infrared Systems and Photoelectronic Technology, (21 October 2004); https://doi.org/10.1117/12.565661
Lens.org Logo
CITATIONS
Cited by 30 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Staring arrays

Sensors

Visible radiation

Quantum efficiency

Readout integrated circuits

Silicon

Astronomy

RELATED CONTENT

IR CMOS: infrared enhanced silicon imaging
Proceedings of SPIE (June 11 2013)
Wafer-scale integration of antimonide-based MWIR FPAs
Proceedings of SPIE (April 12 2021)
Visible and infrared detectors at Rockwell Science Center
Proceedings of SPIE (August 16 2000)
Low-noise CCD signal acquisition techniques
Proceedings of SPIE (June 23 1994)
FPA technology advancements at Rockwell Scientific
Proceedings of SPIE (May 31 2005)

Back to Top