20 December 2004 Hybrid integration platform for planar lightwave subsystems
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We report on a hybrid organic/inorganic platform that allows the integration of passive and active optical functions to form planar lightwave subsystems. The integration approaches include chip-to-chip attach, flip-chip mounting, and insertion of films in slots formed in optical waveguiding circuitry. The materials integrated include polymer, silica, silicon, silicon oxynitride, lithium niobate, indium phosphide, gallium arsenide, yttrium iron garnet, and neodymium iron boron. The functions enabled by the hybrid integration approaches span the range of building blocks needed in optical circuitry, while using the highest-performance material system for each function. We demonstrate a number of subsystems on a chip, including fully reconfigurable optical add/drop multiplexers and tunable optical transmitters.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Louay Eldada, Louay Eldada, "Hybrid integration platform for planar lightwave subsystems", Proc. SPIE 5577, Photonics North 2004: Optical Components and Devices, (20 December 2004); doi: 10.1117/12.567609; https://doi.org/10.1117/12.567609


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