John F. Dove, Allen Chi-Luen Wang,1 Tracee L. Jamison,2 Ramesh Narayanan,3 Akshob V. Bangle,3 Zheng-Xuan Lai,3 James Flattery,3 Douglas Keller,3 Philipp G. Kornreich3
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
We have measured a net gain of 19.5 dB in a 4 mm long piece of Cd3P2Semiconductor Cylinder Fiber (SCF) at a wavelength of 1550 nm. The fiber was pumped from the side with a 100 mW, 832 nm laser. Side pumping is very inefficient since only a small portion of the pump light is absorbed by the very thin, approximately 6.694 nm thick, semiconductor film. However, this pumping arrangement is very convenient and does not require wavelength sensitive input and output couplers. We also measured the absorption spectrum. The absorption spectrum is in good agreement with a theoretical model. The absorption spectrum exhibits a step due to the two direct energy gap conduction bands of the Cd3P2 semiconductor film.
John F. Dove,Allen Chi-Luen Wang,Tracee L. Jamison,Ramesh Narayanan,Akshob V. Bangle,Zheng-Xuan Lai,James Flattery,Douglas Keller, andPhilipp G. Kornreich
"Wide band gain and amplified stimulated emission measurements in Cd3P2 cylinder fiber", Proc. SPIE 5577, Photonics North 2004: Optical Components and Devices, (20 December 2004); https://doi.org/10.1117/12.566397
ACCESS THE FULL ARTICLE
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
The alert did not successfully save. Please try again later.
John F. Dove, Allen Chi-Luen Wang, Tracee L. Jamison, Ramesh Narayanan, Akshob V. Bangle, Zheng-Xuan Lai, James Flattery, Douglas Keller, Philipp G. Kornreich, "Wide band gain and amplified stimulated emission measurements in Cd3P2 cylinder fiber," Proc. SPIE 5577, Photonics North 2004: Optical Components and Devices, (20 December 2004); https://doi.org/10.1117/12.566397