16 November 2004 Thermal modeling of a GaAs-based Mach-Zehnder modulator integrated with a MMIC broad-band driver amplifier
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Abstract
This paper presents a thermo-mechanical analysis of an optoelectronic system including a Mach-Zehnder optical modulator integrated with a broad-band GaAs driver amplifier, forming a module which then is placed into a low temperature co-fired ceramic (LTCC) substrate. All module connections such as voltage supply, RF signals and fiber optic input/output are realized through the LTCC. Thermal analysis of this integrated system shows elevated temperatures in the optical component caused by the heat generated in the power amplifier and dissipated into the substrate-carrier and from there into the LTCC. Temperature profiles along the MZ modulator reveal a strong non-uniformity, reaching a 26C temperature difference between the optical component input and output. A stress-strain analysis is also performed. Preliminary results show significant physical distortion of the optical component, which could cause optical misalignments and additional coupling losses. These findings indicate a need for thermal consideration in early design stages.
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Dritan Celo, Tom J. Smy, Xiaoming Guo, Gerardo Romo, Langis Roy, "Thermal modeling of a GaAs-based Mach-Zehnder modulator integrated with a MMIC broad-band driver amplifier", Proc. SPIE 5579, Photonics North 2004: Photonic Applications in Telecommunications, Sensors, Software, and Lasers, (16 November 2004); doi: 10.1117/12.566311; https://doi.org/10.1117/12.566311
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