Modular MEMS design and fabrication for an 80 x 80 transparent optical cross-connect switch

Andres Fernandez; Bryan P. Staker; Windsor E. Owens; Lawrence P. Muray; James P. Spallas; William C. Banyai

doi:10.1117/12.581901

25 October 2004 Modular MEMS design and fabrication for an 80 x 80 transparent optical cross-connect switch

Andres Fernandez, Bryan P. Staker, Windsor E. Owens, Lawrence P. Muray, James P. Spallas, William C. Banyai

Author Affiliations +

Proceedings Volume 5604, Optomechatronic Micro/Nano Components, Devices, and Systems; (2004) https://doi.org/10.1117/12.581901
Event: Optics East, 2004, Philadelphia, Pennsylvania, United States

Abstract

The ability to transparently switch optical signals from one fiber to another without conversion to the electrical domain is a basic functionality that has a wide range of applications within the fiber optic industry. The so-called 3D-MEMS architecture has emerged as the preferred approach for building transparent, scalable systems with port-counts ranging from 16x16 to 1024x1024. The primary components of the 3D-MEMS architecture are fiber array, lens array, and MEMS mirror array. While a central theme in the MEMS industry is integration, we adopted a strategy of modularization. The key MEMS components, which include mirror array, ceramic substrate, and high-voltage drivers, were manufactured separately and then combined to yield a working product. Central to our modular approach was critical design parameter tolerancing to ensure manufacturability. Results from a large sampling of MEMS components and MEMS assemblies are presented to highlight manufacturability and performance.

Citation Download Citation

Andres Fernandez, Bryan P. Staker, Windsor E. Owens, Lawrence P. Muray, James P. Spallas, and William C. Banyai "Modular MEMS design and fabrication for an 80 x 80 transparent optical cross-connect switch", Proc. SPIE 5604, Optomechatronic Micro/Nano Components, Devices, and Systems, (25 October 2004); https://doi.org/10.1117/12.581901

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