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6 December 2004 Uncooled IRFPA with high-performance and low-thermal time constant
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Uncooled infrared focal plane arrays are being developed for a wide range of thermal imaging applications. Developments are focused on the improvement of their sensitivity enabling the possibility of reducing the pixel pitch in order to decrease the total system size and weight by using smaller optics. We present the ULIS second generation technology used for producing 320 x 240 / 384 x 288 and 160 x 120 IRFPA with a pixel pitch of 35 μm. This enhanced technology has been developed by CEA / LETI since 2001 and transferred to ULIS in 2003. The device architecture will be described. These device are well adapted to high volume military applications (i.e. thermal weapons sight, enhanced driver vision) or commercial applications (non contact thermometers, thermal imaging cameras...) where system specifications are the result of a trade-off between pixel pitch, performance and system weight and volume. We have developed for these devices low cost packages. IRFPA electro-optical characterization is presented.
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Jean Luc Tissot, Michel Vilain, Arnaud Crastes, Sebastien Tinnes, Annick Larre, Olivier Legras, and Jean Jacques Yon "Uncooled IRFPA with high-performance and low-thermal time constant", Proc. SPIE 5612, Electro-Optical and Infrared Systems: Technology and Applications, (6 December 2004);

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