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13 January 2005 Laser-induced change of electrical resistivity of metals and its applications
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Applying of laser alloying for modification of electrical resistivity of metals with significant importance in electrical and electronic engineering and utilization of this method for producing passive elements of electric circuit have been presented. The alloyed metals were obtained by means of laser beams with different wave length and various mode of working (cw or pulse), by different methods for the supplying of alloying elements. It was possible to form alloyed layers of metals forming different types of metallurgical systems: with full (Cu-Au, Cu-Ni) or partial solubility (Mo-Ni, W-Ni, Cu-Al, Ag-Sn), insoluble (Mo-Au and Cu-Cr) and immiscible (Ag-Ni and Ni-Au) metals, with metallic as well as non-metallic additions (oxide). It has been shown as well that it is possible to achieve resistive elements modified in whole cross section, in a single technological process. The results of systematic investigations into the resistivity of alloyed metals in the temperature range of 77-450 K have been presented. The alloyed layers, obtained, were characterised by a range of resistivity from 2.8 x 10-8 Ωm (Cu-Cr) to 128 x 10-8 Ωm (W-Ni). The microstructure and composition of alloyed layers were examined by means of SEM-microscopy and EDX analyser. In selected cases it was shown how results of investigations could be utilized for modification of surface layer of contact materials or to optimize the resistance of laser welded joints. In addition the results of investigations of new developed microtechnology -- producing micro-areas with extremely high resistivity -- have been presented.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ryszard Pawlak, Franciszek Kostrubiec, Mariusz Tomczyk, and Maria Walczak "Laser-induced change of electrical resistivity of metals and its applications", Proc. SPIE 5629, Lasers in Material Processing and Manufacturing II, (13 January 2005);


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