10 February 2005 An experimental research on measuring fracture toughness of high-temperature alloy by holographic moire interferometry
Author Affiliations +
Abstract
The fracture toughness of high-temperature alloy material under high-temperature is tested with the laser moire interfrometric device. The zero-thickness grating is etched on the surface of test piece by electrochemical method directly, expanding the research space of high-temperature alloy’s moire interferometry. The moire fringe is collected and analyzed by CCD imaging system of computer, the test result that indicates imaging quality and measurement precision of moire interferometry are improved.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yongqing Gong, Yongqing Gong, Chaohua Yan, Chaohua Yan, Lihua Fang, Lihua Fang, Min Chen, Min Chen, Daxiang Yu, Daxiang Yu, } "An experimental research on measuring fracture toughness of high-temperature alloy by holographic moire interferometry", Proc. SPIE 5638, Optical Design and Testing II, (10 February 2005); doi: 10.1117/12.575032; https://doi.org/10.1117/12.575032
PROCEEDINGS
6 PAGES


SHARE
RELATED CONTENT


Back to Top