17 January 2005 Design and fabrication of heat sink with impedance matching circuit for high-speed EA modulators
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Abstract
Heat sinks with impedance matching circuit have been designed and fabricated for the packaging of high-speed electroabsorption (EA) modulators. Ti/Cu/Ni/Au metallization system is adopted for the coplanar waveguide (CPW) electrodes and a 50-ohm Ta2N thin-film resistor in parallel with the EA modulator is used for impedance matching. By a matching resistance optimization, a reflection coefficient S11 better than -21 dB has been demonstrated up to 40 GHz. The heat sinks are applied successfully in the 40 GHz Modulator packaging.
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Jianbo Tian, Jianbo Tian, Bing Xiong, Bing Xiong, Lijiang Zhang, Lijiang Zhang, Qin Wan, Qin Wan, Zhizhi Liu, Zhizhi Liu, Jian Wang, Jian Wang, Changzheng Sun, Changzheng Sun, Yi Luo, Yi Luo, } "Design and fabrication of heat sink with impedance matching circuit for high-speed EA modulators", Proc. SPIE 5644, Optoelectronic Devices and Integration, (17 January 2005); doi: 10.1117/12.575526; https://doi.org/10.1117/12.575526
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