21 February 2005 Pulsed-laser induced shock wave in fused silica for thin film interfacial testing
Author Affiliations +
Abstract
Pulsed-laser induced shock wave development in fused silica is analyzed using nonlinear wave mechanics and applied to thin-film spallation experiments. Due to the negative nonlinear elasticity of fused silica, a laser-induced Gaussian stress pulse evolves into a shock after travelling a certain distance in a fused silica substrate. Experimental observations confirm theoretical predictions of shock development. A decompression shock forms and greatly enhances interfacial failure of a thin film deposited on the substrate. The effectiveness of this wave mechanism is further demonstrated by the successful application in testing ultra-thin low dielectric film/Si substrate interfaces.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Junlan Wang, "Pulsed-laser induced shock wave in fused silica for thin film interfacial testing", Proc. SPIE 5647, Laser-Induced Damage in Optical Materials: 2004, (21 February 2005); doi: 10.1117/12.583584; https://doi.org/10.1117/12.583584
PROCEEDINGS
10 PAGES


SHARE
Back to Top