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8 October 2004 Thermo-mechanical damage analysis of through-hole formation by laser drilling for 3D opto-electronic device assembly
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Proceedings Volume 5662, Fifth International Symposium on Laser Precision Microfabrication; (2004) https://doi.org/10.1117/12.596735
Event: Fifth International Symposium on Laser Precision Microfabrication, 2004, Nara, Japan
Abstract
In order to achieve high packaging density and high performance of LSI assembly, 3D stacking approach of electronic and opto-electronic devices has been considered where chip to chip interconnections are realized via micro through-holes formed by rapid excimer laser drilling. Since local damages due to temperature increase and thermal stress might cause device degradation, it is crucial for the process optimization to evaluate the quantity of thermal and stress fields around holes. In this study, we conducted transient thermo-mechanical finite element analysis for laser drilling of GaAs and Si chips considering temperature dependence of materials properties. Relationship among laser fluence, pulse width, repetition times, and the temperature increase and thermal stress are thoroughly investigated using 2-dimensional axisymmetric models.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kiyokazu Yasuda, Masanao Kobayashi, and Kozo Fujimoto "Thermo-mechanical damage analysis of through-hole formation by laser drilling for 3D opto-electronic device assembly", Proc. SPIE 5662, Fifth International Symposium on Laser Precision Microfabrication, (8 October 2004); https://doi.org/10.1117/12.596735
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