Pixel crosstalk and correlation with modulation transfer function of CMOS image sensor

Magali Estribeau; Pierre Magnan

doi:10.1117/12.588382

7 March 2005 Pixel crosstalk and correlation with modulation transfer function of CMOS image sensor

Magali Estribeau, Pierre Magnan

Proceedings Volume 5677, Sensors and Camera Systems for Scientific and Industrial Applications VI; (2005) https://doi.org/10.1117/12.588382
Event: Electronic Imaging 2005, 2005, San Jose, California, United States

Abstract

The Modulation Transfer Function is a common metric used to quantify image quality but inter-pixel crosstalk analysis is also of interest. Because of an important number of parameters influencing MTF, its analytical calculation and crosstalk predetermination are not an easy task for a CMOS image sensor, due to the use of several metal line and transistor in a close proximity of the photodetector. A dedicated test chip (using a technology optimized for imaging applications) has been developed in order to get both MTF data and influence of the various areas of the pixel to its own response and the one of its neighbors. In order to evaluate the contribution of pixel elementary patterns (particularly the in-pixel readout circuitry), several kernels of shielded pixels have been implemented with the central pixel locally unmasked. Analyze of the kernel responses provides a good insight on both Quantum Efficiency and crosstalk contributors. Additionally, the top metal layer has been used to implement metal edge pattern allowing the on-chip measurement of Edge Spread Function so the MTF. The results obtained with pixel kernels and direct MTF measurements, performed on the same chip at different wavelengths, are analyzed and compared in order to correlate them and draw conclusions that can be applied at the design level.

Citation Download Citation

Magali Estribeau and Pierre Magnan "Pixel crosstalk and correlation with modulation transfer function of CMOS image sensor", Proc. SPIE 5677, Sensors and Camera Systems for Scientific and Industrial Applications VI, (7 March 2005); https://doi.org/10.1117/12.588382

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