12 April 2005 Heat damage-free laser-microjet cutting achieves highest die fracture strength
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Abstract
Unlike conventional laser-based technologies, the water jet guided laser does not generate heat damage and contamination is also very low. The negligible heat-affected zone is one reason why die fracture strength is higher than with sawing. This paper first presents the water jet guided laser technology and then explains how it differs from conventional dry laser cutting. Finally, it presents the results obtained by three recent studies conducted to determine die fracture strength after Laser-Microjet cutting.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Delphine Perrottet, Roy Housh, Bernold Richerzhagen, John Manley, "Heat damage-free laser-microjet cutting achieves highest die fracture strength", Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); doi: 10.1117/12.586710; https://doi.org/10.1117/12.586710
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