12 April 2005 High-precision high-speed separation of semiconductor substrates
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Abstract
Scribing with ultra-violet (UV) lasers has emerged as an alternative method of scribing semiconductor wafers for separation, particularly for thin silicon and germanium wafers, as well as other brittle compound semiconductor wafers materials such as GaP and GaAs.
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Jeffrey Patrick Sercel, "High-precision high-speed separation of semiconductor substrates", Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); doi: 10.1117/12.597773; https://doi.org/10.1117/12.597773
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