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12 April 2005 Laser direct-write of embedded electronic components and circuits
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Abstract
The development of embedded surface mount devices, IC's, interconnects and power source elements offers the ability to achieve levels of miniaturization beyond the capabilities of current manufacturing techniques. By burying or embedding the whole circuit under the surface, significant reduction in weight and volume can be achieved for a given circuit board design. In addition, embedded structures allow for improved electrical performance and enhanced function integration within traditional circuit board substrates. Laser-based direct-write (LDW) techniques offer an alternative for the fabrication of such embedded structures at a fraction of the cost and in less time that it would take to develop system-on-chip designs such as ASIC’s. Laser micromachining has been used in the past to machine vias and trenches on circuit board substrates with great precision, while laser forward transfer has been used to deposit patterns and multilayers of various electronic materials. At NRL, we have been exploring the use of these LDW techniques to both machine and deposit the various materials required to embed and connect individual components inside a given surface. This paper describes the materials and processes being developed for the fabrication of embedded microelectronic circuit structures using direct-write techniques alongside with an example of a totally embedded circuit demonstrated to date.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alberto Pique, Bhanu Pratap, Scott A. Mathews, B. Javis Karns, Ray C. Auyeung, Moshe Kasser, Mike Ollinger, Heungsoo Kim, Sam Lakeou, and Craig B. Arnold "Laser direct-write of embedded electronic components and circuits", Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); https://doi.org/10.1117/12.596454
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