12 April 2005 Monitoring steam laser cleaning using optical probe techniques
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Steam laser cleaning of alumina and titanium carbide nanoparticles from silicon substrates is presented. A KrF excimer laser with a wavelength of 248 nm was used to irradiate the substrates in laser cleaning. A water layer of micrometer thickness was deposited on silicon substrates to improve the cleaning process. Cleaning efficiency was measured for different laser fluences ranging from 50 to 250 mJ/cm2 and pulse numbers from 1 to 100. Research work was carried out to address the factors governing steam laser cleaning, during which thickness of water thin film and lift-off velocities of water films from Si substrate surfaces were monitored. In addition, one-dimensional simulations were employed to estimate the temperature increase on the material surfaces upon laser irradiation. Water layer thickness was measured using Fourier Transform Infrared Spectroscopy. Monitoring of both lift-off velocities and water thin film removal time were carried out by optical probing approaches using He-Ne laser of 632.8 nm wavelength.
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Nagaraj Batta, Yongfeng Lu, Xinwei Wang, Jing Shi, Daniel W. Thompson, David W. Doerr, Dennis R. Alexander, "Monitoring steam laser cleaning using optical probe techniques", Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); doi: 10.1117/12.593956; https://doi.org/10.1117/12.593956

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