12 April 2005 New mechanism of ultra-deep drilling of solids by high-power lasers
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A new mechanism of ultra-deep drilling and related molten material expulsion during high-power short-pulse laser ablation of metals, semiconductors and dielectrics is proposed. In this mechanism ultra-deep (multi-micron) heat penetration and melting depths in these materials are assumed to result from their bulk absorption of thermal short-wavelength con-tinuous and characteristic radiation emitted by hot near-surface ablative laser plasmas. Multi-microsecond delays for expulsion of subsonic jets of micron-size droplets and for re-radiation of UV bursts from the irradiated targets are ex-plained by subsurface explosive boiling in bulk of the resulting ultra-deep melt pool.
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Sergey I. Kudryashov, Sergey I. Kudryashov, Andrew V. Pakhomov, Andrew V. Pakhomov, Susan D. Allen, Susan D. Allen, "New mechanism of ultra-deep drilling of solids by high-power lasers", Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); doi: 10.1117/12.589234; https://doi.org/10.1117/12.589234


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