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Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops
Low-temperature wafer-level gold thermocompression bonding: modeling of flatness deviations and associated process optimization for high yield and tough bonds
Department of Defense need for a micro-electromechanical systems (MEMS) reliability assessment program
Long-term reliability of single-crystal silicon thin films: the influence of environment on the fatigue damage accumulation rate
Static and dynamic microdeformable mirror characterization by phase-shifting and time-averaged interferometry