Paper
22 January 2005 Dynamic excitation: a noninvasive technique for initiating stiction repair in MEMS
Author Affiliations +
Abstract
Commercial applications of micro-electromechanical systems (MEMS) continue to be plagued by reliability issues encountered during fabrication and operation. One of the most prevalent problems is the adhesion between adjacent components since adhesive forces are known to promote wear and defect-related failures. In extreme circumstances, the adhesion is large enough to prevent separation, a phenomenon commonly referred to as stiction-failure. The objective of current work is to determine analytically whether dynamic excitation may be used to repair stiction-failed cantilevers. This is accomplished by relating the structural dynamic response to the de-cohesion of stiction-failed micro-cantilever beams under various loading conditions.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Amit A. Savkar, Kevin D. Murphy, and Matthew R. Begley "Dynamic excitation: a noninvasive technique for initiating stiction repair in MEMS", Proc. SPIE 5716, Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS IV, (22 January 2005); https://doi.org/10.1117/12.590849
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Microelectromechanical systems

Interfaces

Mechanics

Adhesives

Electrodynamics

Modal analysis

Reliability

Back to Top