22 January 2005 Design and fabrication of micromirror for MOEMS devices by CMOS-MEMS common process
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Abstract
This paper would propose the design and fabrication methodology of micro mirror for MOEMS devices by CMOS-MEMS common process of CIC, Taiwan. The outstanding features of CMOS-MEMS are mass production, low connections, high precision and easy to combine the circuit with low noise. A {2X3} opposite type Micro Array Thermal Actuator, MATA, is applied to drive the micro mirror for rotation. Such MOEMS would be as a high precision micro positioning device applied on the micro fabrication equipment. A novel elevating structure for the lift of micro mirror is proposed. Warped suspension beam is originally applied on elevating a micro mirror in this work. A modified elevating structure is proposed to improve the lift of micro mirror from 1.1 μm to 14 μm compared to original design. There are three parameters, width, length of the modified elevating structure and the number of single thermal actuators of parallel type MATA, for the performance simulation. The effects of operation voltage varied with three parameters on the displacement of Z axis direction are investigated. The optimum dimension of width, length of modified elevating structure and numbers of single thermal actuator are 10 μm, 240 μm and {1x4} MATA, respectively. Finally, comparisons of mask configuration and real part of finished devices are discussed by SEM photos. The surface quality of micro mirror is almost perfect and the material of micro mirror is aluminum.
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Chien-Chung Tsai, Chien-Chung Tsai, Pao-Ting Cheng, Pao-Ting Cheng, Yao-Chen Tseng, Yao-Chen Tseng, } "Design and fabrication of micromirror for MOEMS devices by CMOS-MEMS common process", Proc. SPIE 5717, MEMS/MOEMS Components and Their Applications II, (22 January 2005); doi: 10.1117/12.589564; https://doi.org/10.1117/12.589564
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