22 January 2005 Comparison of glass processing using high-repetition femtosecond (800 nm) and UV (255 nm) nanosecond pulsed lasers
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Abstract
Laser processing of glass is of significant commercial interest for microfabrication of "lab-on-a-chip" microfluidic devices. High repetition rate pulsed lasers have been investigated and provide adequate processing speeds but suffer from the inherent risk of laser-induced microcracking and other collateral damage induced in the glass. In this paper we present a comparative study between nanosecond deep UV (255nm) frequency doubled copper laser and femtosecond Ti:Sapphire (800nm) regenerative amplifier laser machining of borosilicate glass. Microchannel scribing and high aspect ratio hole drilling is demonstrated in thick glass using direct writing and mask projection techniques. The resulting material structure geometries have been examined using SEM microscopy and white light interferometry. The feasibility of glass laser machining and the significance of each laser type for this application are discussed.
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Dimitris M. Karnakis, Martyn R. H. Knowles, Kevin T. Alty, Martin Schlaf, Howard V. Snelling, "Comparison of glass processing using high-repetition femtosecond (800 nm) and UV (255 nm) nanosecond pulsed lasers", Proc. SPIE 5718, Microfluidics, BioMEMS, and Medical Microsystems III, (22 January 2005); doi: 10.1117/12.588194; https://doi.org/10.1117/12.588194
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