Paper
22 January 2005 Diode laser bonding of planar microfluidic devices, MOEMS, bioMEMS, diagnostic chips, and microarrays
Jie-Wei Chen, Jerry M. Zybko
Author Affiliations +
Abstract
The assembly of plastic microfluidic devices, MOEMS and microarrays requiring high positioning and welding accuracy in the micrometer range, has been successfully achieved using a new technology based on laser transmission welding combined with a photolithographic mask technique. This paper reviews a laser assembly platform for the joining of microfluidic plastic parts with its main related process characteristics and its potential for low-cost and high volume manufacturing. The system consists of a of diode laser with a mask and an automated alignment function to generate micro welding seams with freely definable geometries. A fully automated mask alignment system with a resolution of < 2 &mu;m and a precise, noncontact energy input allows a fast welding of micro structured plastic parts with high reproducibility and excellent welding quality.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jie-Wei Chen and Jerry M. Zybko "Diode laser bonding of planar microfluidic devices, MOEMS, bioMEMS, diagnostic chips, and microarrays", Proc. SPIE 5718, Microfluidics, BioMEMS, and Medical Microsystems III, (22 January 2005); https://doi.org/10.1117/12.609874
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CITATIONS
Cited by 8 scholarly publications.
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KEYWORDS
Microfluidics

Laser welding

Liquids

Diagnostics

Semiconductor lasers

Microopto electromechanical systems

BioMEMS

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